AXI9000

PCBA High-Speed Real-Time Inline Full Inspection AX19000 realizes 3D/CT inline full inspection function. The inspection objects include BGA, QFP, SOP, CSP, CHIP, QFN, plug-in components, power modules and other components. Defects such as tin less, offset, bridge, voids, pillow effect, etc. (selected according to the inspection object).

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Product Features

Unique 3D/CT reconstruction algorithm, reconstruction time is less than 30s (resolution 5um)
High-speed automatic inspection technology, using linear motor three-layer gantry structure to achieve high-speed 3D/CT scanning
According to user needs, scan the sample (or components) in whole or in part
The minimum measurable 0.3mm pitch and banding line images over 0.2mm are clearly distinguishable

Bare Board Inspection

Bare Board Size	50× 50 ~ 610 × 510mm
CT Resolution	5-50um /pixel (optional)
Bare Board Thickness	0.5mm-10mm
Bare Board Height	?40mm

X-Ray Tube Specification

Type	Reflective sealed micro-focus ray source
Voltage Range	40-130 KV
Operating Current Range	10-300µA
Max Output Power	39W

Flat Panel Detector Specification

Type	Amorphous silicon flat panel detector (optional)
Pixel Matrix	1536 × 1536
Field of View	130mm × 130 mm
Resolution	5.8Lp/mm
Frame(1×1)	20fps
A/D Conversion Bit	16bits

Equipment Performance Specifications

Dimensions	L2400mm × W2000mm × H2000mm
Input Power	220V 10A/110V 15A 50-60HZ
Atmospheric Pressure	0.45 ~ 0.65MPa
Control System	DELL Precision T5820 graphics workstation
Net Weight	Approx 6800KG
X-ray Leakage	< 0.5 μSv/hr