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      Home - Other Equipments - Semiconductor Equipment Corporation
    Semiconductor Equipment
 
Model 860 Eagle Omni Bonder Model 830 Pick and Place System
 
Specifications : Specifications :
  • +/-5 um depending on application
  • Die sizes from 0.006” square to 1.00”
  • Four 2”x2” or 4”x4” waffle pack pick-up stage
  • Workstage options include 4”x4” cold stage, 4”x4” heated stage or  3/4 “ rapid heat-up stage.
  • Bond load ranges from 5 grams to 10 kilograms
  • Throughput – up to 200 placements per hour.
  • Compressed Air : 60 psi
  • Vacuum: 20”Hg
  • Cover Gas: 40 psi
  • Power: 115V, 10 amp-50-60 Hz/220V, 15 amp-50-60 Hz
  • Size:40” W x36” D x 36” H
  • Weight: 500 lbs
  • Shipping Weight:600 lbs
  • Plus or minus 25 micron placement accuracy.
  • Four 2” x 2” waffle pack pick-up stage available
  • Four inch square vacuum stage standard (optional sizes available)
  • Consistent bond load
  • Throughput – up to 400 placements per hour
  • Dimensions: 26” W X 18” D X 18” H
  • Weight : 35 lbs
  • Power : 120 VAC 1 amp or 220 VAC 1 amp
  • Vacuum: 20” Hg
 
Model 450 Hot Gas Rework Station Model 4800 Die Ejector Grid
Specifications: Specifications:
  • Weight: 30 lbs
  • Height : 18”
  • Length: 22”
  • Width:14”
  • Shipping Weight: 40 lbs
  • Voltage: 110 or 220 VAC -50/60 Hz-Current 7A
  • Electric current: 3 Amps, 115 V, 60 Hz
  • Weight: 6 Pounds
  • Shipping Weight: 9 Pounds
  • Vacuum : 25”
  • Size: 8”x5”x7”
   
 
 
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