For PCB cleaning or when cleaning populated PCBs, the aim is to remove flux residues from PCBs, hybrids and DCBs.
State-of-the-art PCB Cleaning processes are able to effectively remove all types of flux residues, ranging from RMA to newly developed synthetic materials.
Although the so-called „NoClean“ production has proved itself for many production purposes in the Low-End area, the cleaning of High-End assemblies is essential.
To ensure the reliability of bonding and coating processes, it is of utmost importance to clean the assemblies before bonding/coating. Resin and activator residues that lead to poor coating and bonding adhesion, as well as corrosion and electrical failure are not removed from the assembly during No-Clean manufacturing processes. Furthermore, lead-free solder pastes and flux systems newly introduced to the market during the conversion to lead-free soldering contain a higher content of resin and more aggressive activators.
Modern cleaning technologies have therefore been designed to cope with no-clean formulations, and with adequate equipment optimization this problem can be prevented. ZESTRON offers water-based, semi-aqueous and water-free cleaning processes.