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    Heraeus SMT Adhesive Dispensing
 
PD 955M
PD 955 M is a thermosetting single-component, solvent-freepolymer adhesive, developed especially for the surfacemounting of SMT components on to PCBs and for use onbare substrates.The rheology is especially adapted for high-speed dispensing.It allows for very low Z-Height-returns.
 
Special Advantages
  • Very wide processing window, no tendency to string.
  • Specially developed for high-speed dispensing.
  • Dispensing with very low Z-Height-return possible.
  • Formm stable glue dots.
  • Excellent adhesion with standard and also with difficult-to-glue components.
  • Very low humidity absorption. Steep temperature increase and very short curing times are possible without danger of formation of air bubbles or worse adhesion.
  • High surface insulation resistance (SIR).
 
Data Sheet Profile MSDS
 
 
 
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