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    Heraeus Lead Containing Solder Paste
 
Heraeus Materials Technology is a business group of Heraeus Holding involved in the processing worldwide of precious and platinum group metals as well as a comprehensive range of special metals. In the industrial sector of the precious and special metals business, Heraeus Materials Technology is a leading player
 
F352 Series
The solder pastes of the F352 series comprise a ready-to-use homogeneous mixture with low odour characteristics, consisting of metal powder, binders, solvents, fluxes and thixotropic agents. Its flux is optimised to increase its wetting capability, decrease the odour of the paste, avoid solder balls (on chip-resistors and capacitors) and to increase tack time and stencil life.Solder pastes of the F352 Series does not contain anyhalogen activators. They leave low, clear flux residueswith low ionic contamination and very high SIR. This paste is insensitive to temperature and humidity.
 
F352 flux has passed all tests for no-clean solder pastesaccording to
. Siemens standard SN 59650.
. Bellcore standard TR-NWT-000078
Solder pastes of the F352 Series have very high green strength and are suitable for machines with high accelerations / decelerations. More over they have very long stencil life and can be used in printers with TCU (Temperature Control Unit - very strong ventilation). Their rheology is optimised to allow excellent printing performance with narrow openings and an excellent first print after a pause - e.g. a lunch break. Laboratory tests gave a perfect first print after a break of 18 h. If the paste is properly stored, its composition prevents crusting and ensures the following rheological properties:
. excellent printability
. stable viscosity
 
Data Sheet Profile MSDS
 
F381 Series
The solder pastes of the F381 Series comprise a ready-to-use homogeneous mixture with low odour characteristics, consisting of metal powders, binders, solvents, fluxes and thixotropic agents.This pastes have an outstanding wetting capability (they contain halogenated activators - bonded halogens only), and are ideal for applications where difficult-to-solder surfaces have to be joined. Variation in pad and component solderability is tolerated without a negative effect on yields.The SIR of the flux residues is high. This solder pastes are insensitive to temperature and humidity. They display no tendency to create solder balls on chip resistors and capacitors.The solder pastes of the F381 Series have very high green strength and are suitable for machines with high accelerations / decelerations. Moreover they have very long stencil life and can be used in printers with TCU (Temperature Control Unit - very strong ventilation). Their rheology is optimised to allow excellent printing performance with narrow openings and an excellent first print after a pause - e.g. a lunch break.
 
Data Sheet Profile MSDS
 
 
 
 
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